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About WINTEL

In short

WINTEL is a flash memory manufacturer producing TF cards, UDP modules, custom USB flash drives and semi-finished boards for B2B buyers. Silicon is sourced from SanDisk, Toshiba, Micron, SK Hynix, Intel and Samsung in TSOP, BGA, LGA, COB and eMMC package formats, with controller solutions from Alcor, ITE, Xinbang and Micov. Production runs the full chain in-house: wafer sorting and testing, COB bonding or SMT placement, housing and assembly, marking and branding, then capacity and read/write verification before packing. We sell to device makers, brands and integrators on project volumes — not to retail consumers.

Company facts

  • Legal entity (EN) Shenzhen Wintel Digital Technology Limited
  • Legal entity (CN) 深圳市微盛鑫数码科技有限公司
  • Trading names WINTEL / winTEL
  • Registered in Shenzhen, China
  • Founded 2015-05-12
  • Team in this industry since 2006
  • Employees [Add headcount]
  • Factory area 5,000 m²
  • Export markets 50+ countries
  • Monthly capacity [Add monthly capacity]
  • Contact person Jessica
  • Email jessica@wintel-com.cn
  • Phone (mobile) +86-132 2685 1179
  • Phone (office) +86-755-21011840
  • WhatsApp / WeChat +0085251612090
  • Factory / office No.101, Building 5th, The 3rd Industrial Zone, Bantian Subdistrict, Shenzhen, Guangdong, China
  • Registered office (CN) Room C727, Innovation Plaza, No.2007 Pingshan Avenue, Liulian Community, Pingshan Subdistrict, Shenzhen, Guangdong, China
  • Certifications [Add certification, e.g. ISO 9001]

Fields shown in grey dashed boxes are placeholders awaiting confirmation from the factory. They are excluded from all structured data (Organization, Product, FAQPage) until a confirmed value replaces them.

Legal entity and group

The legal entity behind this site is Shenzhen Wintel Digital Technology Limited 深圳市微盛鑫数码科技有限公司, registered in Shenzhen, China on 2015-05-12. The Chinese name maps onto the English one word for word — 数码 is "Digital" and 科技 is "Technology" — so a Chinese business-registry search and this page resolve to the same company.

The team behind it has worked in this industry since 2006, when a PVC and print factory was established in Shenzhen. A second factory followed, and in 2017 the two were consolidated under the winTEL brand. The company itself was registered under its current legal name in 2015. That is the date you will find in Chinese business records, and it is the date we publish here rather than a marketing figure.

The same legal entity also operates a separate custom gifts business — Custom promotional gifts (PVC, silicone, leather) — through www.wintel-com.cn . That line is run independently from our flash memory production and does not supply anything sold on this site. We state it plainly so that, if you come across both sites, you can reconcile them instead of wondering whether they are two different suppliers.

Product range

  • Product lines 4 — TF cards, UDP modules, USB drives, semi-finished boards
  • Flash grade A+ grade
  • Interfaces USB 2.0 / USB 3.0
  • Capacity range 128MB – 256GB depending on product

What sits behind these products — silicon sources, controller solutions, package formats and the production sequence — is set out below.

Supply chain

Memory package formats

TSOP — Thin Small Outline Package

Legacy NAND package, still widely sourced for cost-sensitive builds.

BGA — Ball Grid Array

Higher-density package used for larger capacities.

LGA — Land Grid Array

Documented in our source material as Apple-component grade LGA parts.

COB — Chip-On-Board

Bare die bonded directly to the PCB — the basis of UDP and card production.

eMMC — Embedded MultiMediaCard

Managed NAND with integrated controller, for embedded designs.

Silicon sources

  • SanDisk
  • Toshiba
  • Micron
  • SK Hynix
  • Intel
  • Samsung

Controller packages and solutions

  • QFN
  • 24-pin
  • 48-pin
  • COB
  • Alcor
  • ITE
  • Xinbang
  • Micov

Production flow

  1. Wafer sorting & testing Die-level screening before packaging.
  2. COB bonding / SMT placement Bare die or packaged part onto the PCB.
  3. Housing & assembly Metal, PVC or wood housing assembly.
  4. Marking & branding Silk-screen, colour print, laser engraving.
  5. Test & pack Capacity / read-write verification, then packaging.

Read and write speed is specified per project rather than fixed across a product line. Tell us the workload and we will confirm what the configuration supports.

On the floor

Photographs taken at our plant in Bantian, Shenzhen. We publish these rather than renders because the question buyers are really asking is whether the factory exists.

WINTEL factory building in Bantian, Shenzhen, with the wintel sign on the roof and above the entrance
The plant in Bantian, Shenzhen — 5,000 m², and the address we publish everywhere else.
Four views of the assembly floor: board placement machinery, automated equipment and assembly stations
Placement, assembly and automated equipment. All of it runs on our own floor — we are not a trading office relaying orders to someone else's plant.
Four views of the factory: test station, test oven, work-in-progress boards in bins, and finished goods on racks
Test station, oven, work-in-progress and finished goods. Capacity is verified before packing, and the verification record is what we send with a shipment.

Evidence we can show you

When you assess a supplier, ask what they can actually evidence. These are the assets we hold today, with their source and review date.

Product specification cards

  • TF Card: 15 × 11 × 1 mm, 0.25 g, 4GB–256GB
  • UDP Module: 11.3 × 24.8 × 1.45 mm, 0.819 g, 128MB–128GB
  • Semi-finished board: 12 × 44 × 4.5 mm, 3.2 g, 128MB–128GB
  • Read/write speed: customizable per order

Source: Customer-supplied product dimension sheets (TF / UDP / General Version)
Reviewed: 2026-09

Silicon sourcing card

  • Package formats: TSOP, BGA, LGA, COB, eMMC
  • Memory sources: SanDisk, Toshiba, Micron, SK Hynix, Intel, Samsung
  • Controller formats: QFN, 24-pin, 48-pin, COB
  • Controller solutions: Alcor, ITE, Xinbang, Micov

Source: Customer-supplied controller & chip briefing documents
Reviewed: 2026-09

Business registration card

  • Legal entity (EN): Shenzhen Wintel Digital Technology Limited
  • Legal entity (CN): 深圳市微盛鑫数码科技有限公司
  • Registered office: Room C727, Innovation Plaza, No.2007 Pingshan Avenue, Pingshan, Shenzhen
  • Registration date: 2015-05-12
  • Factory / office: Bantian 3rd Industrial Zone, Longgang District, Shenzhen — 5,000 m²

Source: Chinese business registration record supplied by the company
Reviewed: 2026-09

Corporate presence card

  • Other official sites of the same entity: wintel-com.cn, go-wintel.com
  • Public profiles: Facebook, LinkedIn, YouTube, Instagram — links on our Contact page
  • Business contact: Jessica — email, mobile, office line and WhatsApp/WeChat are published
  • Domain and registration records are held under the same entity in Shenzhen, China

Source: Domain records plus the company’s own sites and social profiles, each opened and checked
Reviewed: 2026-09

What we cannot publish yet

We would rather state this plainly than let you assume. The following are not currently available as published evidence, and we will tell you directly if you ask:

  • Named customer references and project case studies
  • Third-party certifications (ISO / CE / FCC / RoHS) certificate scans
  • Monthly production capacity figures
  • Independent test reports (capacity, endurance, failure rate)

If any of these are a requirement for your procurement process, raise it when you enquire and we will tell you what we can provide and by when.

Who writes this site

Technical and product pages are written and reviewed by the WINTEL Engineering Team. Our in-house engineering team covers wafer sorting and testing, controller solution selection, SMT assembly, and molding. Pages carry an updated date, and sources are linked wherever a figure comes from third-party reporting rather than our own data.

If you need a supplier who will tell you what they can and cannot document, send us your specification.

Contact WINTEL